My parts shipped, but it will be a couple of days before I receive them. I was doing some research on the best way to remove the smd caps and came up with everything but that. On my adventure into the unknown I saw that 100 lead smd chips are easily removed with a heat gun at the proper temp. I experimented on a dead snes mobo i had tried to repair with no success. I also damaged that same mobo the process, rookie mistakes (I lifted some traces on some multi lead components).
So this time, I tried the heat gun method to remove the components. Works great!! My technique and heat gun needed a little tweaking before I started to remove the components from the good mobo. I needed a nozzle on my heat gun but that would require me to order one and wait for that too. I am too impatient and do not like to wait, so I Macgyver'ed my own with some household materials.
I don't know if this nozzle is safe to use on a heat gun for any period of time but I was impatient and needed these things off now. LOL If you try my method and something goes wrong I will not be held responsible for anything that might happen. So if you do, please do not blame me if anything goes wrong because I do not recommend this technique. The right way is with some soldering tweezers.
Although i do not recommend this, I will tell you that everything went smooth as butter. No broken traces or burnt/melted components.
Here are some pics of my rig. LOL, don't hate..
I used some aluminum foil, a pencil, scotch tape, needle nose pliers and a heat gun (750f low - 1500f high)
I folded the aluminum foil in half and wrapped it around the heat gun nozzle and part of the actual heat gun itself.
After I folded it, I molded it to the shape of the heatgun by crushing the aluminum foil with my hand. I left the tip untouched.
I then stuck a pencil in the middle to taper the tip to a smaller diameter by crushing it as well.
I used a second piece of aluminum foil and repeated the process.
When I finished i removed the pencil.
I used a strip of tape one the top and bottom to stop the nozzle from flying off.
I then prepped the board by covering the components and plastic I did not want to heat up. (very important)
I set the mobo on a phonebook. Using the needle nose pliers, I grabbed the faulty component and lifted the mobo about a 1/4 of an inch off the phone book. The opposite side of the mobo is resting on the phone book, so there is not too much tension and I will not break any traces off. While lifting I began to heat the component on "low" with the heatgun. As soon as the solder melted, I let gravity pull the mobo down freeing the component. As soon as the mobo drops I immediately stopped heating the mobo.
After removing all of the components I used my radioshack desoldering iron to clean off any left over solder. I need to buy some desoldering braid to clean it up a bit more, but for now its good. Covering the tip of the desoldering iron with some flux and solder will help.
After I finished everything, I used a paper towel and some 70% alcohol to clean up the left over flux.
Well that's all for now.